Molex Launches Impress Co-Packaged Copper Solutions
prnewswire.com · 2026-02-18 · Source article
Molex launched Impress Co‑Packaged Copper, a compression‑attached substrate connector system that supports up to 224Gbps PAM‑4, places the connection on the ASIC package substrate to reduce signal loss and simplify rework, and will be shown at DesignCon where Molex will also present sessions on high‑speed cable‑harness signal‑integrity testing.